Flex
Materials
Material : PET, PEN, POLYIMIDI
Layers : 1 - 8
Copper thickness : 18/18 µm and 35/35 µm
Board thickness : 50 µm and 125 µm
Production limits
Smallest hole size : 0,2 mm
Smallest isolation : 250 µm
Smallest track width : 250 µm
Smallest annular ring : 250 µm
Surfaces
Solder mask : Green, photo imageable
Solderable surface : immersion gold/silver/nickel
