Rigid
Materials
Base material : FR4 Tg135 (max. High Tg230), CEM, ROGERS, ARLON, Isola, etc.
Layer count : 1 - 24
Copper thickness : 18, 35, 70, 105 µm
Laminates 1 & 2 -layers : 0,2 - 3,2 mm
Multilayer, 3 layers: from 0,4 mm
Production limits
Smallest hole size : 0,2 mm
Smallest isolations : 100 µm
Smallest track width : 100 µm
Smallest annular ring : 125 µm
Biggest board size : 600 mm × 1000 mm
Impedance control 100X
Surfaces
Soldermask : Green, red, blue, black
Component print : White, black, red
Solderable surface : immersion gold/silver/nickel, HAL, HAL lead-free nickel, OSP, carbon paste, gold-plated edge connector
